Leaded Solder Paste

High-quality leaded solder paste designed for reliable soldering in electronic assembly applications. Offers smooth printing, consistent viscosity, and strong joint reliability.

Leaded Solder Paste is a high-performance soldering material formulated with a tin-lead alloy, providing excellent solderability and consistent performance for PCB assembly and rework. Its balanced flux system ensures superior wetting, minimal residue, and reduced voiding during reflow. The paste maintains stable viscosity for fine-pitch printing and stencil applications, making it ideal for both manual and automated processes. Suitable for use in through-hole and surface-mount soldering operations across electronics, automotive, and telecommunications industries.

Features:

• Excellent solderability and wetting performance

• Stable viscosity for stencil printing

• Low residue and clean joint appearance

• Reliable electrical and mechanical connections

• Compatible with standard reflow profiles

Applications:

• PCB assembly and rework

• SMT soldering processes

• Electronic and electrical component soldering